HIGHER YIELDS, PRODUCTION FLEXIBILITY
ISDN Solutions drive automation in front-end and back-end IC manufacturing processes. From wafer handling to manufacturing, testing and packaging, our automation solutions are being used to drive higher yields, greater product mix, and more advanced capability throughout the semiconductor value chain.
ELECTRONICS & SEMICONDUCTOR SOLUTIONS
Semiconductor Capital Equipment
Our solutions include advanced motion control for manfacturing testing and packaging equipment, machine-to-machine integration; and bespoke process-, equipment- and line-level automation.
IC manufacturing and test processes are rapidly exceeding the capabilities of standard equipment. ISDN provides bespoke engineering solutions to advance your capabilities when standard equipment reaches its limits.
Our engineering capabilities support control intelligence from the PLC level up to cloud intelligence control to help customers keep pace with the fast-growing automation needs of the IC industry.
WE ARE HERE TO ADDRESS YOUR CHALLENGES
ISDN’s semiconductor expertise, engineering depth and access to thousands of global suppliers help drive cost-effective automation solutions for our customers.
We help to implement real-time data and analytics solutions to improve your Overal Equipment Effectiveness (OEE), system availability and performance outcomes.
QUALITY AND YIELD
Our solutions are helping the industry move towards finer pitch manufacturing and assembly, automation-driven yield improvements, and faster cycle times as IC product mix increases.
We help customers drive higher machine ROI by providing solutions that are modular, software-defined, and connected, reducing the need for "fork lift" replacements for lower-cost capability upgrades.